OCP Summit 2026: Powering AI with Open Innovations in Scale-Up, Scale-Out, and Scale-Across Networks

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At the 2026 Open Compute Project Global Summit, Meta is sharing the next generation of open networking infrastructure, including: Our first liquid-cooled network rack (IcePack), and 102.4T switch platform (IceCube). Flattened Planar Fabric (FPF), a multiplane backend scale-out fabric that fundamentally changes how GPUs connect to the network MetaRoCE, our open-source AI transport protocol. Launching the Open Switch Platform Architecture (OSPA) initiative within OCP.

在 2026 年开放计算项目（OCP）全球峰会上，Meta 分享了下一代开放网络基础设施，包括：我们首个液冷网络机架（IcePack）和 102.4T 交换机平台（IceCube）；扁平化平面架构（FPF），这是一种多平面后端横向扩展架构，从根本上改变了 GPU 连接网络的方式；MetaRoCE，我们的开源 AI 传输协议；以及在 OCP 内部启动开放交换机平台架构（OSPA）倡议。

We’re inviting engineers, silicon vendors, system integrators, and operators to join us and the OCP community in meeting the challenges of building open, efficient, and sustainable AI infrastructure. At Meta, we believe that open networking is critical for building high-performance, scalable, and sustainable infrastructure, and we’ve acted on that conviction since co-founding the Open Compute Project (OCP) in 2011.

我们诚邀工程师、芯片供应商、系统集成商和运营商加入我们及 OCP 社区，共同应对构建开放、高效且可持续的 AI 基础设施所带来的挑战。在 Meta，我们坚信开放网络对于构建高性能、可扩展且可持续的基础设施至关重要，自 2011 年共同创立开放计算项目（OCP）以来，我们一直践行这一信念。

Throughout the ongoing AI revolution, Meta has pushed the boundaries of what’s possible in data center networking and shared our advances with the industry. At OCP 2025, we introduced our latest AI scale-out fabrics and drove the creation of the Ethernet for Scale-Up Networking (ESUN) initiative. This year at OCP 2026, we’re sharing the networking innovations that directly support our latest AI workloads such as Meta’s Muse Wonder and Muse Spark models, and Muse, our personal AI agent built for everyone.

在持续的 AI 革命中，Meta 不断突破数据中心网络技术的极限，并与业界分享我们的进展。在 OCP 2025 上，我们推出了最新的 AI 横向扩展架构，并推动了“面向纵向扩展网络的以太网”（ESUN）倡议的建立。今年在 OCP 2026 上，我们分享了直接支持我们最新 AI 工作负载的网络创新，例如 Meta 的 Muse Wonder 和 Muse Spark 模型，以及我们为每个人打造的个人 AI 智能体 Muse。

The 102.4T Generation: Liquid-Cooled Networking at AI Scale. As AI clusters grow to gigawatt scale, network switches must deliver dramatically more bandwidth while fitting within increasingly dense power and cooling envelopes. Our answer is the IcePack rack, Meta’s first-generation liquid-cooled network rack. IcePack is based on OCP’s ORV3-HPRv1 rack standard. IceCube switch blades — 102.4-Tbps fabric switches that deliver 128×800G non-blocking switching capacity — sit inside each rack.

102.4T 时代：AI 规模下的液冷网络。随着 AI 集群增长至吉瓦（GW）规模，网络交换机必须在适应日益密集的功耗和散热限制的同时，提供大幅提升的带宽。我们的解决方案是 IcePack 机架，这是 Meta 第一代液冷网络机架。IcePack 基于 OCP 的 ORV3-HPRv1 机架标准。每个机架内装有 IceCube 交换机刀片——即提供 128×800G 无阻塞交换能力的 102.4 Tbps 架构交换机。

Flattened Planar Fabric (FPF): More Resilient, Larger Clusters. We’re introducing Flattened Planar Fabric (FPF), Meta’s multiplane backend scale-out fabric that fundamentally changes how GPUs connect to the network and the network control plane of the fabric. With FPF, each GPU connects via eight independent 100G links to eight different switches (one per network plane). This multiplane approach replaces the traditional single-plane uplink architecture and delivers four key advantages.

扁平化平面架构（FPF）：更具弹性、规模更大的集群。我们推出了扁平化平面架构（FPF），这是 Meta 的多平面后端横向扩展架构，从根本上改变了 GPU 连接网络的方式以及架构的网络控制平面。通过 FPF，每个 GPU 通过八条独立的 100G 链路连接到八台不同的交换机（每个网络平面一台）。这种多平面方法取代了传统的单平面上行链路架构，并带来了四大关键优势。